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Typical Properties Of Adhesive Material For Flex PCB

PropertyAcrylicModified EpoxyButyral Phenolic
Chemical resistance GOOD Very good EXCELLENT
Temperature resistance EXCELLENT GOOD GOOD
Electrical properties GOOD Very Good EXCELLENT 
Bond strength EXCELLENT GOOD Fair 
Flexibility Very Good GOOD EXCELLENT 
Moisture absorption GOOD Very Good Very Good 
Peel strength post solder 7.01b/in min 8.01b/in min 5.01b/in min
Adhesive flow Mils/mil 5mils max 5mils max 5mils max
Moisture absorption Max% 6.0 4.0 2.0
Surface resistivity Min 100000 10000 10000
Dissipation factor @1MHz 0.05 0.06 0.025
Dielectric constant @1MHz 4.0 max 4.0 max 3.0 max

PSA is the simplest and most inexpensive adhesive materials in FPC processing, as the name, no special pressure sensitive adhesive lamination process, you can manually paste it into dielectric surface, but it is rather poor chemical and temperature resistance, so The main purpose is to paste the stiffening plate.

The stated values are typical and will vary among different brand material.

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