FP Circuits Ltd

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Typical Properties Of Dielectric Material For Flex PCB

PropertyPolyester(Adh)Polyimide(Adh)Polyimide(Adhesiveless)
MECHANICAL
Thickness Range 0.025 ~ 0.5 mil 1~6 mil 0.5~5 mil
Flexing (R~2.0mm)  FAIR GOOD EXCELLENT 
Thermal Forming YES NO NO 
Modulus  2800~5500 MPa 2500 MPa 4000 MPa 
Tear Strength  800 g  500 g  500 g 
Peel Strength (Ambient) 1050 N/M  1750 N/M  1225 N/M 
CHEMICAL/ENVIRONMENTAL
Caustic (>20%) EXCELLENT POOR GOOD 
UV POOR-PET / FAIR-PEN  GOOD EXCELLENT 
UL Recognition/Max. operating Temp.  85~160 celsius  85~160 celsius 105-200 celsius
Flame Retardancy  VTM-0 with FR Adhesive VTM-0 with FR Adhesive VTM-0
Water Absorption (ASTM D570)  <0.8% (24h) 2.9% (24h) 0.8% (24h)
ELECTRICAL
Dielectric Constant (1 MHz) 3.4 3.5 3.3 
Dielectric Strength 4~5 Kv/25 um  3~5 Kv/25 um 5 Kv/25 um 
Dissipation Factor (1 MHz) 0.018 0.01 0.003
Insulation Resistance 1000 ohm-cm 1000 ohm-cm 1000 ohm-cm
THERMAL   
Solder Processing 5 sec @246~260 celsius 5 sec @288 celsius (Predry Req.) 10 sec @288 celsius (No Predry)
Assembly   
Through Hole LIMITED EXCELLENT EXCELLENT
Surface Mount (IR Reflow) PEN,YES / PET,NO GOOD TO EXCELLENT EXCELLENT
Wire Bonding NO SOME ADH. ARE OK EXCELLENT
CHIP (Direct Attach) POOR  FAIR TO EXCELLENT EXCELLENT

The stated values are typical and will vary among different brand material.

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